(China (Mainland))
Product Summary
The I3-330M is a 64-bit, multi-core mobile processor. It builts on 32-nanometer process technology. Based on the low-power/high-performance Nehalem micro-architecture, the I3-330M is designed for a two-chip platform, as opposed to the traditional three-chip platforms (processor, GMCH, and ICH). The two-chip platform consists of a processor and the Platform Controller Hub (PCH) and enables higher performance, lower cost, easier validation, and improved x-y footprint. The I3-330M is designed for the Calpella platform and is offered in an rPGA988A or a BGA1288 package.
Parametrics
I3-330M absolute maximum ratings: (1)Processor Core voltage with respect to VSS:-0.3V to 1.40V ; (2)Voltage for the memory controller and Shared Cache with respect to VSS:-0.3V to 1.40V ; (3)Processor I/O supply voltage for DDR3 with respect to VSS:-0.3V to 1.80V ; (4)Processor PLL voltage with respect to VSS:-0.3V to 1.98V ; (5)Graphics voltage with respect to VSS:SV:-0.3V to 1.55V, LV:-0.3V to 1.55V, ULV:-0.3V to 1.55V.
Features
I3-330M features: (1)One or two channels of DDR3 memory with a maximum of one SO-DIMM per channel; (2)Single- and dual-channel memory organization modes; (3)Data burst length of eight for all memory organization modes; (4)Memory DDR3 data transfer rates of 800 MT/s (SV, LV, ULV) and 1066 MT/s (SV, LV); (5)64-bit wide channels; (6)DDR3 I/O Voltage of 1.5 V; (7)Non-ECC, unbuffered DDR3 SO-DIMMs only; (8)Command launch modes of 1n/2n; (9)Partial Writes to memory using Data Mask (DM) signals; (10)On-Die Termination (ODT); (11)Downstream SMI, SCI and SERR error indication; (12)Legacy support for ISA regime protocol (PHOLD/PHOLDA) required for parallel port ; (13)DMA, floppy drive, and LPC bus masters; (14)DC coupling – no capacitors between the processor and the PCH Polarity inversion; (15)Conditional self-refresh (Intel Rapid Memory Power Management(Intel RMPM)); (16)Dynamic power-down; (17)Intel Smart 2D Display Technology (Intel S2DDT); (18)Intel Display Power Saving Technology (Intel DPST); (19)Graphics Render C-State (RC6); (20)Digital Thermal Sensor; (21)Adaptive Thermal Monitor; (22)THERMTRIP# and PROCHOT# support; (23)On-Demand Mode; (24)Open and Closed Loop Throttling; (25)Memory Thermal Throttling; (26)External Thermal Sensor (TS-on-DIMM and TS-on-Board); (27)Render Thermal Throttling; (28)Fan speed control with DTS.
Diagrams
